Light-emitting device and method of manufacturing the same

ABSTRACT

A light-emitting device and a method of manufacturing the same. The light-emitting device includes a body portion, and a light-emitting portion arranged in the body portion and configured to emit light to the outside. The light-emitting portion includes a plurality of pixels. At least two of the pixels are configured to emit pieces of light having different wavelengths from each other.

CROSS REFERENCE TO RELATED APPLICATION

This application claims priority from and the benefit of Korean PatentApplication No. 10-2020-0098192, filed on Aug. 5, 2020, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

Exemplary embodiments of the invention relate to a light-emitting deviceand a method of manufacturing the same.

Discussion of the Background

In recent years, light-emitting devices have been used for skin careusing light in the beauty market, or have been used for lesiontreatments using light in the medical market. Light-emitting devices mayprovide an optimized cosmetic or therapeutic effect by emitting lighthaving a certain wavelength to the outside.

A light-emitting device may include a plurality of pixels that emitlight having a certain wavelength to the outside. Each of the pixels ismade to emit pieces of light having the same wavelength to the outside,so that the light-emitting device may be optimized for one effect.

In general, when a light-emitting device emits light having a certainwavelength to the outside, a cosmetic or therapeutic effect optimizedfor a single lesion may be provided, but a new light-emitting device hasto be used for providing different effects to a user.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Exemplary embodiments of the invention provide a light-emitting devicefor providing pieces of light having various wavelengths, and a methodof manufacturing the same.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

An exemplary embodiment of the invention provides a light-emittingdevice including a body portion, and a light-emitting portion arrangedin the body portion and configured to emit light to the outside. Thelight-emitting portion includes a plurality of pixels configured to emitsame color, and a pixel defining layer defining an emission area of eachof the plurality of pixels. At least two of the plurality of pixels areconfigured to emit pieces of light having different wavelengths fromeach other, and an auxiliary layer of an intermediate layer in each ofthe plurality of pixels is arranged on at least two pixels adjacent toeach other among the plurality of pixels and the pixel defining layerbetween adjacent pixels.

Each of the plurality of pixels may be further configured to emit atleast one of white light, red light, green light, and blue light.

Each of the plurality of pixels may include a pixel electrode, anopposite electrode arranged to face the pixel electrode, and an emissionlayer between the pixel electrode and the opposite electrode, and theauxiliary layer may be arranged between the emission layer and the pixelelectrode and/or between the emission layer and the opposite electrode.

At least two of the plurality of pixels may have different intervalsbetween the pixel electrode and the opposite electrode.

Thicknesses of the auxiliary layers of the two pixels adjacent to eachother among the plurality of pixels may be different from each other.

Thicknesses of the auxiliary layers of the two or more pixels adjacentto each other among the plurality of pixels may be different from eachother.

The auxiliary layer may include a first auxiliary layer arranged on someof the plurality of pixels, and a second auxiliary layer arranged onothers of the plurality of pixels, and at least a portion of the firstauxiliary layer may overlap at least a portion of the second auxiliarylayer.

A first line connecting centers of the first auxiliary layer and thesecond auxiliary layer arranged on a plane may intersect with a secondline connecting centers of adjacent pixels among the plurality ofpixels.

At least some of the plurality of pixels may form one pixel group, and atotal thickness of the intermediate layers arranged in the one pixelgroup may be greatest in the pixel arranged at a center of the one pixelgroup.

The total thickness of the intermediate layers arranged in the one pixelgroup may decrease from the pixel arranged at the center of the onepixel group to a pixel arranged at an outer side of the one pixel group.

Thicknesses of at least two intermediate layers in the plurality ofpixels may be different from each other.

Another exemplary embodiment of the invention provides a method ofmanufacturing a light-emitting device including arranging a processsubstrate and a mask assembly in a chamber, depositing a depositionmaterial by supplying the deposition material from a deposition sourceto the process substrate through the mask assembly, shifting the processsubstrate or the mask assembly in a first direction, and depositing adeposition material by supplying the deposition material from thedeposition source to the process substrate through the mask assembly.

The method may further include shifting the process substrate or themask assembly in a second direction.

The first direction and the second direction may be perpendicular toeach other.

The mask assembly may include a pattern hole through which thedeposition material passes, and the pattern hole may be formed to guidethe deposition material to at least two pixels arranged in a depositionarea of the process substrate.

The deposition material may be deposited on the process substrate toform an auxiliary layer.

The method may further include depositing the deposition material in adeposition confirmation area of the process substrate.

The deposition confirmation area may be between adjacent depositionareas of the process substrate.

Another exemplary embodiment of the invention provides a method ofmanufacturing a light-emitting device including depositing a depositionmaterial on a first area of a process substrate, and depositing adeposition material on a second area of the process substrate, whereinat least a portion of the first area overlaps at least a portion of thesecond area.

At least two pixels may be arranged in each of the first area and thesecond area, and a thickness of the deposition material in the pixelarranged only in the first area or the second area may be different froma thickness of the deposition material in the pixel arranged in an areain which the first area overlaps the second area.

These general and specific aspects may be implemented by using a system,a method, a computer program, or any combination thereof

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1 is a perspective view of a light-emitting device according to anembodiment.

FIG. 2 is a bottom view of a light-emitting portion of thelight-emitting device illustrated in FIG. 1.

FIG. 3 is a cross-sectional view of the light-emitting device takenalong line C-C′ of FIG. 2.

FIG. 4 is a cross-sectional view illustrating an apparatus formanufacturing a light-emitting device, according to an embodiment.

FIG. 5 is a perspective view of a mask assembly illustrated in FIG. 4.

FIG. 6 is a plan view of a portion of a process substrate illustrated inFIG. 4.

FIG. 7 is a plan view of a deposition confirmation portion of a processsubstrate, according to an embodiment.

FIG. 8 is a plan view illustrating a deposition method according to anembodiment.

FIG. 9 is a plan view of a deposition confirmation portion of a processsubstrate, according to another embodiment.

FIG. 10 is a plan view illustrating a deposition method according toanother embodiment.

FIGS. 11A, 11B, and 11C are cross-sectional views illustrating aprocedure of depositing a deposition material on a process substrateaccording to the deposition method illustrated in FIG. 8 or 10.

FIG. 12 is a cross-sectional view of a portion of a light-emittingportion of a light-emitting device, according to another embodiment.

FIG. 13 is a cross-sectional view of a portion of a light-emittingportion of a light-emitting device, according to another embodiment.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments of the invention. As usedherein, “embodiments” are non-limiting examples of devices or methodsemploying one or more of the inventive concepts disclosed herein. It isapparent, however, that various exemplary embodiments may be practicedwithout these specific details or with one or more equivalentarrangements. In other instances, well-known structures and devices areshown in block diagram form in order to avoid unnecessarily obscuringvarious exemplary embodiments. Further, various exemplary embodimentsmay be different, but do not have to be exclusive. For example, specificshapes, configurations, and characteristics of an exemplary embodimentmay be used or implemented in another exemplary embodiment withoutdeparting from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, the D1-axis, the D2-axis,and the D3-axis are not limited to three axes of a rectangularcoordinate system, such as the x, y, and z-axes, and may be interpretedin a broader sense. For example, the D1-axis, the D2-axis, and theD3-axis may be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

FIG. 1 is a perspective view illustrating a light-emitting device 1according to an embodiment.

Referring to FIG. 1, the light-emitting device 1 may include a bodyportion 10 and a light-emitting portion 20. The body portion 10 maydefine an inner space therein, and various devices may be arranged inthe inner space of the body portion 10. For example, a controller thatcontrols the light-emitting portion 20, a power supply connected to thecontroller, and the like may be arranged in the body portion 10. In thiscase, the power supply may have various shapes. Specifically, the powersupply may include a primary battery that is replaceably coupled to thebody portion 10. In another embodiment, the power supply may include abattery, such as a rechargeable secondary battery, arranged in the bodyportion 10. In another embodiment, the power supply may include a deviceconnected to the outside via a cable. In the above case, when the powersupply includes a primary battery or a battery, the light-emittingdevice 1 may be portable. The body portion 10 may be connected to theoutside via a cable or the like. The cable may be detachably connectedto the body portion 10. In this case, various pieces of information maybe input from the outside via the cable. In another embodiment, the bodyportion 10 may include a wireless communication module therein. In thiscase, the light-emitting device 1 may be connected to an external devicethrough wireless communication to exchange information with the externaldevice.

The light-emitting portion 20 may be connected to the body portion 10.In this case, the light-emitting portion 20 may emit light to theoutside of the body portion 10. In this case, the light-emitting portion20 may emit light having at least two or more wavelengths. Inparticular, the light-emitting portion 20 may emit at least two piecesof light having the same color and different wavelengths. For example,the light-emitting portion 20 may emit at least two pieces of lighthaving a red color and different wavelengths. In another embodiment, thelight-emitting portion 20 may emit at least two pieces of light having ablue color and different wavelengths. In another embodiment, thelight-emitting portion 20 may emit at least two pieces of light having ared color and different wavelengths. In another embodiment, thelight-emitting portion 20 may emit at least two pieces of light having awhite color and different wavelengths. In this case, the light-emittingportion 20 may include a plurality of pixels, and the pixels may emitpieces of light having the same color.

Hereinafter, the light-emitting portion 20 will be described in detail.

FIG. 2 is a bottom view of the light-emitting portion 20 of thelight-emitting device 1 illustrated in FIG. 1. FIG. 3 is across-sectional view of the light-emitting device 1 taken along lineC-C′ of FIG. 2.

Referring to FIGS. 2 and 3, the light-emitting portion 20 may include aplurality of pixels Px. Each of the pixels Px may include one pixelelectrode 28A and may emit one piece of light. In this case, each of thepixels Px may emit light having the same color. The pixel Px may bedefined as an area in which one piece of light is emitted. For example,the pixel Px may be defined by an opened area of a pixel defining layer29. In this case, the pixel Px may emit one of white light, red light,yellow light, green light, or blue light. In this case, all of thepixels Px may emit pieces of light having the same color.

The light-emitting portion 20 may define an emission area DA and aperipheral area PA outside the emission area DA on a substrate 21. Thepixels Px may be arranged in the emission area DA, and a power line (notillustrated) and the like may be arranged in the peripheral area PA.Also, a pad portion PD may be arranged in the peripheral area PA. Inthis case, the peripheral area PA may be an area in which the pixels Pxare not arranged and may be an area in which light is not emitted to theoutside.

The light-emitting portion 20 may include a display substrate D and asealing member (not illustrated) arranged on the display substrate D. Inthis case, the sealing member may include a sealing portion arranged inthe display substrate D and an encapsulation substrate (not illustrated)connected to the sealing portion and arranged to face the substrate 21.In another embodiment, the sealing member may include a thin-filmencapsulation layer E that shields at least a portion of the displaysubstrate D. Hereinafter, for convenience of description, a case inwhich the sealing member includes the thin-film encapsulation layer Ewill be described.

The display substrate D may include a substrate 21, a thin-filmtransistor (TFT) arranged on the substrate 21, and an organiclight-emitting device (OLED) 28.

The substrate 21 may include glass or a polymer resin. The polymer resinmay include polyethersulfone, polyacrylate, polyetherimide, polyethylenenaphthalate, polyethylene terephthalate, polyphenylene sulfide,polyarylate, polyimide, polycarbonate, or cellulose acetate propionate.The substrate 21 including the polymer resin may be flexible, rollable,or bendable. The substrate 21 may have a multiple layer structureincluding an inorganic layer (not illustrated) and a layer including theabove-described polymer resin.

The TFT may be formed on the substrate 21, a passivation layer 27 may beformed to cover the TFT, and the OLED 28 may be formed on thepassivation layer 27.

A buffer layer 22 including an organic compound and/or an inorganiccompound may be further formed on the upper surface of the substrate 21.The buffer layer 22 may include SiO_(x) or SiN_(x).

An active layer 23 arranged in a certain pattern is formed on the bufferlayer 22, and then, the active layer 23 is buried by a gate insulatinglayer 24. The active layer 23 includes a source region 23A and a drainregion 23C, and further includes a channel region 23B between the sourceregion 23A and the drain region 23C.

The active layer 23 may include various materials. For example, theactive layer 23 may include an inorganic semiconductor material such asamorphous silicon or crystalline silicon. In another example, the activelayer 23 may include an oxide semiconductor. In another example, theactive layer 23 may include an organic semiconductor material. However,for convenience of description, a case in which the active layer 23includes amorphous silicon will be described in detail.

The active layer 23 may be formed by forming an amorphous silicon layeron the buffer layer 22, crystallizing the amorphous silicon layer toform a polycrystalline silicon layer, and patterning the polycrystallinesilicon layer.

In the active layer 23, the source region 23A and the drain region 23Care doped with impurities according to a type of a TFT such as a drivingTFT (not illustrated) or a switching TFT (not illustrated).

A gate electrode 25 corresponding to the active layer 23 and aninterlayer insulating layer 26 burying the gate electrode 25 are formedon the upper surface of the gate insulating layer 24.

Contact holes H1 are formed in the interlayer insulating layer 26 andthe gate insulating layer 24, and a source electrode 27A and a drainelectrode 27B are formed on the interlayer insulating layer 26 so as tocome in contact with the source region 23A and the drain region 23C,respectively.

The passivation layer 27 is formed on the TFT, and a pixel electrode 28Aof the OLED 28 is formed on the passivation layer 27. The pixelelectrode 28A comes in contact with the source electrode 27A of the TFTvia a via hole H2 formed in the passivation layer 27. The passivationlayer 27 may include an inorganic material and/or an organic material,and may include a single layer, or two or more layers. The passivationlayer 27 may be formed as a planarization layer so that the uppersurface thereof is flat regardless of a concave or convex shape of alower layer. Alternatively, the passivation layer may be concave orconvex according to a concave or convex shape of a lower layer. Thepassivation layer 27 may include a transparent insulator so as toachieve a resonance effect.

After the pixel electrode 28A is formed on the passivation layer 27, thepixel defining layer 29 is formed to cover the pixel electrode 28A andthe passivation layer 27 and is opened so that the pixel electrode 28Ais exposed.

An intermediate layer 28B and an opposite electrode 28C are formed onthe pixel electrode 28A. In another embodiment, the opposite electrode28C may be formed on the entire surface of the display substrate D. Inthis case, the opposite electrode 28C may be formed on the intermediatelayer 28B and the pixel defining layer 29. Hereinafter, for convenienceof description, a case in which the opposite electrode 28C is formed onthe intermediate layer 28B and the pixel defining layer 29 will bedescribed in detail.

The pixel electrode 28A functions as an anode electrode, and theopposite electrode 28C functions as a cathode electrode. Of course, thepolarities of the pixel electrode 28A and the opposite electrode 28C maybe reversed.

The pixel electrode 28A and the opposite electrode 28C are insulatedfrom each other by the intermediate layer 28B, and voltages of differentpolarities are applied to the intermediate layer 28B to emit light froman organic emission layer.

The intermediate layer 28B may include an organic emission layer 28B-2.As another optional example, the intermediate layer 28B may include atleast one of an organic emission layer 28B-2, a lower auxiliary layer28B-1, and an upper auxiliary layer 28B-3. In this case, the lowerauxiliary layer 28B-1 may include a hole injection layer (HIL) and/or ahole transport layer (HTL). Also, the upper auxiliary layer 28B-3 mayinclude an electron transport layer (ETL) and/or an electron injectionlayer (EIL). In this case, the upper auxiliary layer 28B-3 may bebetween the organic emission layer 28B-2 and the opposite electrode 28C,and the lower auxiliary layer 28B-1 may be between the organic emissionlayer 28B-2 and the pixel electrode 28A.

Some pixels Px may form one pixel group, and the one pixel group mayinclude at least three pixels Px. Hereinafter, for convenience ofdescription, a case in which one pixel group includes six pixels Px willbe described in detail.

Thicknesses of intermediate layers 28B of the six pixels Px included inthe one pixel group may be different from each other. In particular, thesix pixels Px included in the one pixel group may be arranged in a rowin one direction. For example, the six pixels Px may include three pairsof pixels Px. In this case, each pair of pixels Px may have the samethickness. Specifically, the intermediate layer 28B of the pixel Pxarranged in a first area A1, which is an outermost area, in the onepixel group may have a first thickness W1. Also, the intermediate layer28B of the pixel Px arranged in a third area A3, which is a middle area,in the one pixel group may have a third thickness W3. The intermediatelayer 28B of the pixel Px arranged between the first area A1 and thethird area A3 in the one pixel group may have a second thickness W2. Inthe above case, the first thickness W1 may be different from the secondthickness W2, and the second thickness W2 may be different from thethird thickness W3. Specifically, of the first to third thicknesses W1,W2, and W3, the first thickness W1 may be the smallest and the thirdthickness W3 may be the largest.

When the thicknesses of the intermediate layers 28B arranged in eachpixel Px are different from each other, the pixels Px having differentthicknesses may emit pieces of light having different wavelengths. Forexample, as the thickness of the intermediate layer 28B of each pixel Pxincreases, light having a longer wavelength may be generated. That is,in FIG. 3, the wavelength of light emitted from the first area A1 may bethe shortest and the wavelength of light emitted from the third area A3may be the longest. The wavelength of light emitted from the second areaA2 is longer than the wavelength of light emitted from the first area A1and may be shorter than the wavelength of light emitted from the thirdarea A3.

In this case, the first area A1, the second area A2, and the third areaA3 may be repeated in the one pixel group. In particular, the first areaA1, the second area A2, and the third area A3 may be sequentiallyarranged in a first direction (e.g., an X-axis direction in FIG. 3) in aportion of the one pixel group, and the third area A3, the second areaA2, and the first area A1 may be sequentially arranged in the firstdirection in another portion of the one pixel group. In this case, thetwo third areas A3 may be adjacent to each other, the two third areas A3are between the two second areas A2, and the two second areas A2 and thetwo third areas A3 may be between the two first areas A1. In this case,the one pixel group may be between the two third areas A3, and bothsides thereof may be symmetrical with respect to a center line of thetwo third areas A3 (e.g., a straight line arranged in a Z-axis directionin FIG. 3). In the above case, the thickness of the intermediate layer28B of the pixels Px arranged in each area may decrease sequentially asthe distance from the center line of the two third areas A3 increases.For example, the thickness of the intermediate layer 28B may decrease ina direction from the third area A3 to the first area A1. In this case,the thickness of the intermediate layer 28B may be equal to the distancebetween the pixel electrode 28A and the opposite electrode 28C of eachpixel Px. That is, the thickness of the intermediate layer 28B may meana height from the upper surface of the pixel electrode 28A to the lowersurface of the opposite electrode 28C in each pixel Px. In anotherembodiment, the thickness of the intermediate layer 28B of the pixel Pxarranged closest to the center line with respect to the center line ofthe one pixel group may decrease as the distance from the center line ofthe one pixel group increases. That is, when the center line of thepixel group passes through the center of the pixel Px arranged at thecenter of the pixel group, the thickness of the intermediate layer 28Bof the pixel Px may be greater than the thicknesses of the intermediatelayers 28B of the other pixels Px.

In the above case, the thicknesses of the intermediate layers 28B of thepixels Px adjacent to each other among the six pixels Px arranged in theone pixel group may be different from each other. For example, thesecond thickness W2 of the intermediate layer 28B of the pixel Pxarranged in the second area A2 and the third thickness W3 of theintermediate layer 28B of the pixel Px arranged in the third area A3adjacent to the second area A2 may be different from each other. Forexample, the first thickness W1 of the intermediate layer 28B of thepixel Px arranged in the first area A1 and the third thickness W3 of theintermediate layer 28B of the pixel Px arranged in the third area A3adjacent to the first area A1 may be different from each other.

Each of the pixels Px may include a pixel electrode 28A, an organicemission layer 28B-2, an auxiliary layer, and an opposite electrode 28C.In this case, the pixel electrode 28A may be arranged to correspond toeach of the pixels Px, and the organic emission layer 28B-2 and theopposite electrode 28C may be arranged on the entire surface of thesubstrate 21 of the light-emitting portion 20. In this case, the pixelsPx may share the organic emission layer 28B-2 and the opposite electrode28C with each other. Also, at least two pixels Px adjacent to each otheramong the pixels Px may share the auxiliary layer with each other. Inparticular, in these cases, the auxiliary layer may be arranged over atleast two pixels Px adjacent to each other among the pixels Px and theupper surface of the pixel defining layer 29 arranged between the atleast two pixels Px adjacent to each other among the pixels Px. Forexample, the pixel Px arranged in the third area A3 and the pixel Pxarranged in the second area A2 in FIG. 3 may share the upper auxiliarylayer 28B-3 and/or the lower auxiliary layer 28B-1 with each other.

A plurality of upper auxiliary layers 28B-3 may be provided, and/or aplurality of lower auxiliary layers 28B-1 may be provided. For example,a plurality of upper auxiliary layers 28B-3 may be provided, and onlyone lower auxiliary layer 28B-1 may be provided. In another embodiment,only one upper auxiliary layer 28B-3 may be provided, and a plurality oflower auxiliary layers 28B-1 may be provided. In another embodiment, aplurality of upper auxiliary layers 28B-3 and a plurality of lowerauxiliary layers 28B-1 may be provided. Hereinafter, for convenience ofdescription, a case in which a plurality of lower auxiliary layers 28B-1are provided will be described in detail.

The lower auxiliary layer 28B-1 may include at least two lower auxiliarylayers 28B-1 arranged to be stacked on each other. In the following, forconvenience of description, a case in which three lower auxiliary layers28B-1 are provided will be described in detail. For example, the lowerauxiliary layer 28B-1 may include a first lower auxiliary layer 28B-1A,a second lower auxiliary layer 28B-1B, and a third lower auxiliary layer28B-1C. In this case, the first lower auxiliary layer 28B-1A, the secondlower auxiliary layer 28B-1B, and the third lower auxiliary layer 28B-1Cmay include the same material or different materials. For example, allof the first lower auxiliary layer 28B-1A, the second lower auxiliarylayer 28B-1B, and the third lower auxiliary layer 28B-1C may be a holeinjection layer or a hole transport layer. In another embodiment, one ofthe first lower auxiliary layer 28B-1A, the second lower auxiliary layer28B-1B, and the third lower auxiliary layer 28B-1C may be a holeinjection layer, and the others thereof may be a hole transport layer.In the following, for convenience of description, a case in which all ofthe first lower auxiliary layer 28B-1A, the second lower auxiliary layer28B-1B, and the third lower auxiliary layer 28B-1C include the samematerial will be described in detail.

The first lower auxiliary layer 28B-1A, the second lower auxiliary layer28B-1B, and the third lower auxiliary layer 28B-1C may be arranged indifferent areas from each other. That is, one of the first lowerauxiliary layer 28B-1A, the second lower auxiliary layer 28B-1B, thethird lower auxiliary layer 28B-1C may at least partially overlap theother one thereof on a plane. For example, on the left side of FIG. 3,the first lower auxiliary layer 28B-1A may be arranged to cover thepixel Px arranged in the first area A1, the pixel Px arranged in thesecond area A2, and the pixels Px arranged in the two third areas A3. Inthis case, the pixel Px arranged in the first area A1, the pixel Pxarranged in the second area A2, and the pixels Px arranged in the twothird areas A3, which are adjacent to each other, may share the firstlower auxiliary layer 28B-1A. The second lower auxiliary layer 28B-1Bmay be arranged to cover the pixel Px arranged in the second area A2 onthe left side of FIG. 3, the pixels Px arranged in the two third areasA3, and the pixel Px arranged in the second area A2 on the right side ofFIG. 3. The third lower auxiliary layer 28B-1C may be arranged to coverthe pixels Px arranged in the two third areas A3 in FIG. 3, the pixel Pxarranged in the second area A2 on the left side of FIG. 3, and the pixelPx arranged in the first area A1 on the right side of FIG. 3. In thiscase, similar to the first lower auxiliary layer 28B-1A, the adjacentpixels Px may share the second lower auxiliary layer 28B-1B and thethird lower auxiliary layer 28B-1C.

In the above case, only the first lower auxiliary layer 28B-1A may bearranged in one of the pixels Px arranged in the two first areas A1, andonly the third lower auxiliary layer 28B-1C may be arranged in the otherof the pixels Px arranged in the two first areas A1. Also, the firstlower auxiliary layer 28B-1A and the second lower auxiliary layer 28B-1Bmay be arranged in one of the pixels Px arranged in the two second areasA2, and the second lower auxiliary layer 28B-1B and the third lowerauxiliary layer 28B-1C may be sequentially stacked in the other of thepixels Px arranged in the two second areas A2. Each of the pixels Pxarranged in the two third areas A3 may include the first lower auxiliarylayer 28B-1A, the second lower auxiliary layer 28B-1B, and the thirdlower auxiliary layer 28B-1C, which are sequentially stacked. When thefirst lower auxiliary layer 28B-1A, the second lower auxiliary layer28B-1B, and the third lower auxiliary layer 28B-1C are arranged asdescribed above, the thicknesses of the lower auxiliary layers 28B-1arranged in the pixels Px may be different from each other.

An end of at least one of the first lower auxiliary layer 28B-1A, thesecond lower auxiliary layer 28B-1B, and the third lower auxiliary layer28B-1C may be arranged on the pixel defining layer 29. That is, the endof at least one of the first lower auxiliary layer 28B-1A, the secondlower auxiliary layer 28B-1B, and the third lower auxiliary layer 28B-1Cmay be arranged between the adjacent pixels.

The organic emission layer 28B-2, the upper auxiliary layer 28B-3, andthe opposite electrode 28C may be sequentially stacked on the lowerauxiliary layer 28B-1. Also, a thin-film encapsulation layer E may bearranged on the opposite electrode 28C.

The thin-film encapsulation layer E may include a plurality of inorganiclayers, or may include an inorganic layer and an organic layer.

The organic layer of the thin-film encapsulation layer E may include apolymer-based material. The polymer-based material may includepolyethylene terephthalate, polyethylene naphthalate, polycarbonate,polyimide, polyethylenesulfonate, polyoxymethylene, polyarylate,hexamethyldisiloxane, acrylic resin (e.g., polymethylmethacrylate,polyacrylic acid, etc.), or any combination thereof.

The inorganic layer of the thin-film encapsulation layer E may includeone or more inorganic insulating materials selected from aluminum oxide,titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, siliconoxide, silicon nitride, and silicon oxynitride.

The upper layer of the thin-film encapsulation layer exposed to theoutside may include an inorganic layer so as to prevent moisturepermeation to the OLED 28.

The thin-film encapsulation layer E may include at least one sandwichstructure in which at least one organic layer is inserted between atleast two inorganic layers. As another example, the thin-filmencapsulation layer E may include at least one sandwich structure inwhich at least one inorganic layer is inserted between at least twoorganic layers. As another example, the thin-film encapsulation layer Emay include a sandwich structure in which at least one organic layer isinserted between at least two inorganic layers and a sandwich structurein which at least one inorganic layer is inserted between at least twoorganic layers.

The thin-film encapsulation layer E may include a first inorganicencapsulation layer, a first organic encapsulation layer, and a secondinorganic encapsulation layer sequentially disposed from the top of theOLED 28.

In another example, the thin-film encapsulation layer E may include afirst inorganic encapsulation layer, a first organic encapsulationlayer, a second inorganic encapsulation layer, a second organicencapsulation layer, and a third inorganic encapsulation layersequentially disposed from the top of the OLED 28.

In another example, the thin-film encapsulation layer E may include afirst inorganic encapsulation layer, a first organic encapsulationlayer, a second inorganic encapsulation layer, a second organicencapsulation layer, a third inorganic encapsulation layer, a thirdorganic encapsulation layer, and a fourth inorganic layer sequentiallydisposed from the top of the OLED 28.

A metal halide layer including LiF may be further included between theOLED 28 and the first inorganic encapsulation layer. When the firstinorganic encapsulation layer is formed by sputtering, the metal halidelayer may prevent the OLED 28 from being damaged.

The areas of the first organic encapsulation layer may be less than thearea of the second inorganic encapsulation layer, and the area of thesecond organic encapsulation layer may also be less than the area of thethird inorganic encapsulation layer.

When the inorganic layers are provided as described above, the inorganiclayers may be deposited so as to come in direct contact with each otherat edges of the light-emitting portion 20, and the organic layer may notbe exposed to the outside.

Therefore, the light-emitting portion 20 may emit pieces of light havingdifferent wavelengths to the outside while emitting pieces of lighthaving the same color.

The light-emitting portion 20 may operate in various ways. For example,the light-emitting portion 20 may operate so that a pixel arranged in atleast one of the first area A1, the second area A2, and the third areaA3, which are arranged in one pixel group, emits light.

Specifically, the light-emitting portion 20 may operate such that onlythe pixel Px arranged in the first area A1, the second area A2, or thethird area A3 emits light, and thus, light having one wavelength isemitted to the outside.

In another embodiment, the light-emitting portion 20 may operate suchthat the pixels Px arranged in at least two of the first area A1, thesecond area A2, and the third area A3 emit light, and thus, pieces oflight having at least two wavelengths are emitted.

In another embodiment, the light-emitting portion 20 may operate suchthat the pixels Px respectively arranged in the first area A1, thesecond area A2, and the third area A3 emit light according to time, andthus, pieces of light having different wavelengths are emitted atdifferent times.

Because the light-emitting portion 20 may freely emit pieces of lighthaving various wavelengths, pieces of light having various effects maybe provided to a user.

FIG. 4 is a cross-sectional view illustrating an apparatus formanufacturing a light-emitting device, according to an embodiment. FIG.5 is a perspective view of a mask assembly illustrated in FIG. 4.

Referring to FIGS. 4 and 5, the apparatus for manufacturing thelight-emitting device may include a chamber 110, a deposition source120, a mask assembly 130, a substrate support 140, a mask support 150,and a magnetic force generator 160, a pressure regulator 170, and avision portion 180.

The chamber 110 may define an inner space therein, and one side of thechamber 110 may be opened so that a process substrate MS is unloadedfrom the chamber 110 or is accommodated in the chamber 110. In thiscase, a shielding portion 111 including a gate valve or the like may bearranged in the opened portion of the chamber 110 to selectively open orclose the chamber 110. The process substrate MS may be formed in variousforms. For example, the process substrate MS may include one depositionarea. In another embodiment, the process substrate MS may include atleast two deposition areas. In this case, at least two deposition areasmay be spaced apart from each other. In the deposition area, the pixelelectrode or the organic emission layer may be formed on the substrate.In another embodiment, the process substrate MS may refer to thesubstrate itself of the above-described display device. In anotherembodiment, the process substrate MS may mean a state in which theabove-described various layers are formed on an original substrate, andthe original substrate is divided into at least two parts. In anotherembodiment, the process substrate MS may refer to the above-describeddisplay substrate D.

The deposition source 120 may accommodate a deposition material forforming at least one of the auxiliary layers described above. In thiscase, the deposition source 120 may vaporize or sublimate the depositionmaterial by applying energy (e.g., heat energy, light energy, vibrationenergy, etc.).

The deposition source 120 may be replaceable. At this time, thedeposition source 120 may be replaced with a new deposition source 120when the accommodated deposition material is exhausted. Also, thedeposition source 120 may be fixed inside the chamber 110, or may belinearly movable.

The mask assembly 130 may include a mask frame 131, a mask sheet 132,and a support frame 133.

The mask frame 131 may have an opening formed in the center thereof Inthis case, the mask frame 131 may be formed in a shape such as a windowframe. In another embodiment, the mask frame 131 may have an openingformed in the center thereof, and a separate frame dividing the openingin a grid shape may be arranged. Hereinafter, for convenience ofdescription, the mask frame 131 having one opening formed in the centerthereof will be described in detail.

The mask sheet 132 may be arranged on one surface of the mask frame 131in a state of being stretched in the first direction and/or the seconddirection and may be fixed to the mask frame 131 through welding or thelike. In this case, a groove may be formed in the mask frame 131 toaccommodate the mask sheet 132. The mask sheet 132 may be formed in arectangular shape and may be arranged at one side of the mask frame 131.Also, the mask sheet 132 may be formed in a slit shape.

In an embodiment, a plurality of mask sheets 132 may be provided. Inthis case, the mask sheets 132 may be arranged in a row so as to beadjacent to each other in the first direction or the second direction.In particular, in this case, the long side of the mask sheet 132 may bearranged parallel to the long side or the short side of the mask frame131.

In another embodiment, one mask sheet 132 may be provided to completelyshield the upper surface of the mask frame 131.

Hereinafter, for convenience of description, a case in which a pluralityof mask sheets 132 are provided and the long sides of the mask sheets132 are arranged in the X-axis direction of FIG. 5 will be described indetail.

A plurality of pattern holes 132A may be provided in the mask sheet 132.In this case, the pattern holes 132A may be apart from each other in thefirst direction and the second direction. In particular, the patternholes 132A may be formed in various shapes. For example, in anembodiment, the pattern holes 132A may have a rhombus shape in whichvertices are arranged in a tensile direction of the mask sheet 132. Inanother embodiment, the pattern holes 132A may have a rectangular shape.In this case, the long side of the pattern hole 132A may be arranged inthe length direction of the mask sheet 132 or in a directionperpendicular to the length direction of the mask sheet 132. In anotherembodiment, the pattern holes 132A may have a circular shape. However,for convenience of description, a case in which the pattern hole 132Ahas a rectangular shape will be described in detail.

The pattern hole 132A may be arranged to correspond to at least somepixels Px arranged on the process substrate MS (or the display substrateD). That is, in a plan view, openings of at least two pixel defininglayers 29 may be arranged inside the pattern hole 132A.

The mask frame 131 and the mask sheet 132 may each include aconfirmation hole 131A for confirming the degree of deposition of thedeposition material. In this case, the confirmation hole 131A may beformed in a shape different from that of the pattern hole 132A.Hereinafter, for convenience of description, a case in which theconfirmation hole 131A is arranged in the mask frame 131 will bedescribed in detail.

The support frame 133 may be arranged on the mask frame 131 to supportthe mask frame 131 and also support the mask sheet 132. In this case,the support frame 133 may be arranged on the mask frame 131 in a gridform to define a display area (not illustrated) of one display device(not illustrated). That is, the support frame 133 may define a pluralityof display areas by dividing the central opening of the mask frame 131into a plurality of areas.

The substrate support 140 may support the process substrate MS. In thiscase, the substrate support 140 may support the process substrate MS insuch a manner that the process substrate MS is seated on the substratesupport 140, or the substrate support 140 may support the processsubstrate MS by adsorbing or attaching one surface of the processsubstrate MS. For example, the substrate support 140 may include aframe, a bar, or the like, which is fixed inside the chamber 110. Inanother embodiment, the substrate support 140 may include a clampconfigured to hold the process substrate MS. In another embodiment, thesubstrate support 140 may include an adhesive chuck or an electrostaticchuck. In this case, the substrate support 140 may be integrally formedwith the magnetic force generator 160. In another embodiment, thesubstrate support 140 may include a shuttle configured to transfer theprocess substrate MS from the outside of the chamber 110 to the insideof the chamber 110. However, for convenience of description, a case inwhich the substrate support 140 includes a shuttle will be described indetail.

The mask support 150 may support the mask assembly 130. In this case,because the mask support 150 may be identical or similar to thesubstrate support 140 described above, a detailed description thereofwill be omitted for convenience of description. Also, a case in whichthe mask support 150 includes the frame fixed inside the chamber 110 andthe mask assembly 130 is seated and supported to the frame will bedescribed in detail.

The magnetic force generator 160 may be arranged in the chamber 110 tobring the mask frame 131 into close contact with the process substrateMS. In this case, the magnetic force generator 160 may include anelectromagnet.

The pressure regulator 170 may be connected to the chamber 110 toregulate the pressure inside the chamber 110. In this case, the pressureregulator 170 may include a pipe connected to the chamber 110, and apump arranged in the pipe.

The vision portion 180 may be arranged in the chamber 110. In this case,the vision portion 180 may be arranged to be inserted into the chamber110, or may be arranged outside the chamber 110. Although notillustrated, when the vision portion 180 is arranged outside the chamber110, a transmission window may be separately provided in the chamber110. The vision portion 180 may include a camera configured to capturean image.

Regarding the operation of the apparatus 100 for manufacturing thelight-emitting device, the apparatus 100 for manufacturing thelight-emitting device may form at least one of the auxiliary layers onthe process substrate MS.

Specifically, the process substrate MS and the mask assembly 130 may becharged into the chamber 110. In this case, one deposition area may bearranged on one surface of the process substrate MS, or a plurality ofdeposition areas apart from each other may be arranged on the processsubstrate MS. Such a deposition area may become a display device when aplurality of layers are arranged on the process substrate MS. In anembodiment, before the auxiliary layers are formed by the apparatus 100for manufacturing the light-emitting device, the pixel electrode 28Adescribed above with reference to FIG. 3 may be formed in the depositionarea. In an embodiment, before the auxiliary layers are formed by theapparatus 100 for manufacturing the light-emitting device, the organicemission layer 28B-2 described above with reference to FIG. 3 may beformed in the deposition area.

When the process substrate MS and the mask assembly 130 are seated onthe substrate support 140 and the mask support 150, respectively, thepositions of the process substrate MS and the mask assembly 130 may bephotographed through the vision portion 180, and the positions of theprocess substrate MS and the mask assembly 130 may be aligned with eachother based on the photographed positions.

When the above process is completed, the deposition material may besupplied from the deposition source 120 to the process substrate MS. Inthis case, the deposition material may be deposited on the processsubstrate MS through the pattern hole 132A. The above process may beperformed on a portion of the process substrate MS, and the depositionmaterial may be deposited on the entire surface of the process substrateMS by changing the position of the process substrate MS or the maskassembly 130. In this case, the process substrate MS may includedeposition areas in which the deposition materials are deposited in acertain pattern and spaced apart from each other. When such depositionareas are deposited, the apparatus 100 for manufacturing thelight-emitting device may perform deposition a plurality of times. Thatis, the apparatus 100 for manufacturing the light-emitting device mayform the auxiliary layers with different thicknesses in the respectiveportions of the deposition area by depositing the deposition material inthe deposition area while changing the position of the mask assembly130.

When the above process is completed in the apparatus 100 formanufacturing the light-emitting device, the process substrate MS may beunloaded from the chamber 110 and transferred to another apparatus formanufacturing a light-emitting device to form an organic emission layer,another auxiliary layer, an opposite electrode, a thin-filmencapsulation layer, and the like on the auxiliary layer. In anotherembodiment, when the above process is completed, the process substrateMS may be unloaded from the chamber 110 and transferred to anotherapparatus for manufacturing a light-emitting device to form an oppositeelectrode, a thin-film encapsulation layer, and the like on theauxiliary layer.

Therefore, the apparatus 100 for manufacturing the light-emitting deviceforms an auxiliary layer at least two or more times on the correspondingportion of the process substrate MS of at least one pixel Px, therebyfreely adjusting the thickness of the intermediate layer of the pixelPx. Also, because the apparatus 100 for manufacturing the light-emittingdevice does not need to use a separate equipment or a plurality of maskassemblies 130 so as to adjust the thickness of the auxiliary layer onone process substrate MS, the manufacturing time and the manufacturingcosts may be reduced.

FIG. 6 is a plan view of a portion of the process substrate MSillustrated in FIG. 4.

Referring to FIG. 6, a deposition confirmation portion PM may bearranged on the process substrate MS. In this case, when the processsubstrate MS includes a plurality of deposition areas EA, the depositionconfirmation portion PM may be between the deposition areas EA of theprocess substrate MS. In another embodiment, when the process substrateMS includes one deposition area EA, the deposition confirmation portionPM may be arranged on the outer portion of the deposition area EA of theprocess substrate MS.

FIG. 7 is a plan view of a deposition confirmation portion PM of aprocess substrate, according to embodiments. FIG. 8 is a plan viewillustrating a deposition method according to an embodiment.

Referring to FIGS. 6 to 8, various patterns may be arranged in thedeposition confirmation portion PM. For example, the depositionconfirmation portion PM may include a first direction pattern MR1arranged in a first direction and a second direction pattern MR2arranged in a second direction. In this case, the second directionpattern MR2 may include a (2-1)^(th) direction pattern MR2-1, a(2-2)^(th) direction pattern MR2-2, and a (2-3)^(th) direction patternMR2-3. The (2-1)^(th) direction pattern MR2-1, the (2-1)^(th) directionpattern MR2-2, and the (2-3)^(th) direction pattern MR2-3 may be apartfrom each other in the first direction. In this case, the firstdirection and the second direction may be perpendicular to each other.

In the above case, a deposition material passing through a confirmationhole 131A may be deposited on the deposition confirmation portion PM. Inparticular, when the deposition material passes through the confirmationhole 131A, a first deposition material pattern M1 may be arranged at afirst point at which an extension line of the first direction patternMR1 and an extension line of the (2-1)^(th) direction pattern MR2-1intersect with each other. Also, when the mask assembly 130 is shiftedonce in the first direction and the deposition is then performed, asecond deposition material pattern M2 may be arranged at a second point.When the mask assembly 130 is shifted once more in the first directionand the deposition is then performed, a third deposition materialpattern M3 may be arranged at a third point. In this case, theconfirmation hole 131A may be arranged in the mask frame 131 of the mostdownstream side with respect to the shifting direction of the maskassembly 130.

When the deposition is performed while the mask assembly 130 is shifted,the pattern hole 132A may be arranged at a position PO1, as illustratedin FIG. 8. In this case, the pattern holes 132A may be arranged tocorrespond to four pixels Px arranged in the first to third areas A1 toA3 on the left side of FIG. 3. In this case, the deposition materialpassing through the pattern hole 132A may be deposited on a portion ofthe process substrate MS corresponding to the pattern hole 132A of thefirst position PO1. When the mask assembly 130 is shifted once, thepattern hole 132A may be arranged at a second position PO2. In thiscase, the pattern holes 132A may be arranged to correspond to pixels Pxarranged in the second area A2 and the third area A3 on the left side ofFIG. 3 and the second area A2 on the right side of FIG. 3. In this case,the deposition material passing through the pattern hole 132A may bedeposited on the corresponding pixel Px. Also, when the mask assembly130 is shifted again, the pattern hole 132A may be shifted from thesecond position PO2 to the third position PO3. In this case, the patternhole 132A of the third position PO3 may be arranged to correspond topixels Px arranged in two third areas A3 in FIG. 3, the second area A2on the right side of FIG. 3, and the first area A1 on the right side ofFIG. 3.

When the mask assembly 130 is shifted as described above, whether theshifting of the mask assembly 130 is performed accurately may beevaluated by comparing the pattern of the deposition material arrangedon the process substrate MS through the confirmation hole 131A with thefirst direction pattern MR1 and the second direction pattern MR2.

That is, after the first deposition material pattern M1, the seconddeposition material pattern M2, and the third deposition materialpattern M3 are formed at a point at which the first direction patternMR1 and the second direction pattern MR2 intersect with each other,whether the first deposition material pattern M1, the second depositionmaterial pattern M2, and the third deposition material pattern M3 areformed at the correct points are determined through the vision portion180. In this manner, the accuracy of the shifting of the mask assembly130 may be confirmed.

The case of fixing the process substrate MS and shifting the maskassembly 130 has been described in detail, but embodiments of thedisclosure are not limited thereto.

Specifically, the above operation may be performed while fixing the maskassembly 130 and shifting the process substrate MS. In this case, thedeposition process may be performed on the process substrate MS whileshifting the process substrate MS in a direction opposite to theshifting direction of the mask assembly 130 described above.

FIG. 9 is a plan view of a deposition confirmation portion PM of aprocess substrate, according to another embodiment. FIG. 10 is a planview illustrating a deposition method according to another embodiment.

Referring to FIGS. 9 and 10, the deposition confirmation portion PM mayinclude a first direction pattern MR1 and a second direction patternMR2. In this case, because the second direction pattern MR2 is the sameas that described above with reference to FIG. 8, a detailed descriptionthereof will be omitted.

The first direction pattern MR1 may include a (1-1)^(th) directionpattern MR1-1, a (1-2)^(th) direction pattern MR1-2, and a (1-3)^(th)direction pattern MR1-3. In this case, the (1-1)^(th) direction patternMR1-1, the (1-2)^(th) direction pattern MR1-2, and the (1-3)^(th)direction pattern MR1-3 may be apart from each other in a seconddirection.

When a deposition material is deposited on a process substrate MS byusing a mask assembly 130, a deposition material may be deposited on theprocess substrate MS while shifting the mask assembly 130 or the processsubstrate MS. Hereinafter, for convenience of description, the case ofdepositing the deposition material on the process substrate MS whileshifting the mask assembly 130 will be described in detail.

When the deposition is performed after the mask assembly 130 and theprocess substrate MS are aligned with each other, the depositionmaterial passing through the confirmation hole 131A is deposited on thedeposition confirmation portion PM to form a first deposition materialpattern M1 at a first point at which an extension line of the (1-1)^(th)direction pattern MR1-1 and an extension line of the (2-1)^(th)direction pattern MR2-1 intersect with each other. At this time, thepattern hole 132A may be arranged at a first position PO1. In this case,the pattern holes 132A may be arranged to correspond to four pixels Pxarranged in the first to third areas A1 to A3 on the left side of FIG. 3in one pixel group.

When the deposition is performed after the mask assembly 130 is shifted,the deposition material passing through the confirmation hole 131A isdeposited on the deposition confirmation portion PM to form a seconddeposition material pattern M2 at a second point at which an extensionline of the (1-2)^(th) direction pattern MR1-2 and an extension line ofthe (2-2)^(th) direction pattern MR2-2 intersect with each other. Inthis case, the pattern hole 132A may be arranged at a second positionPO2. At this time, the pattern holes 132A may be arranged to correspondto pixels Px arranged in the second area A2 and the third area A3 on theleft side of FIG. 3 and the second area A2 on the right side of FIG. 3in one pixel group.

When the deposition is performed after the mask assembly 130 is shiftedagain, the deposition material passing through the confirmation hole131A is deposited on the deposition confirmation portion PM to form athird deposition material pattern M3 at a third point at which anextension line of the (1-3)^(th) direction pattern MR1-3 and anextension line of the (2-3)^(th) direction pattern MR2-3 intersect witheach other. At this time, the pattern hole 132A may be arranged at asecond position PO2. In this case, the pattern holes 132A may bearranged to correspond to pixels Px arranged in two third areas A3 inFIG. 3, the second area A2 on the right side of FIG. 3, and the firstarea A1 on the right side of FIG. 3 in one pixel group.

When the deposition is performed as described above, the mask assembly130 may be shifted in the first direction and the second direction. Thatis, the mask assembly 130 may be shifted in a direction shifting fromthe first deposition material pattern M1 to the second depositionmaterial pattern M2. Also, the mask assembly 130 may be shifted in adirection shifting from the second deposition material pattern M2 to thethird deposition material pattern M3.

When the mask assembly 130 is shifted as described above, the patternhole 132A may not deviate from the range of pixels disposed in eacharea. That is, the mask assembly 130 may be shifted so that the plane ofthe opening of the pixel defining layer arranged in each pixel iscompletely inside the pattern hole 132A in a plan view.

When the mask assembly 130 is shifted as described above, the maskassembly 130 may not be shifted only in the first direction, but may beshifted in the second direction while shifted in the first direction. Inthis case, as illustrated in FIG. 9, the first deposition materialpattern M1, the second deposition material pattern M2, and the thirddeposition material pattern M3 may not be shifted in the first directionor the second direction, but may be shifted in a direction inclined withrespect to the first direction and the second direction. Also, in thiscase, when the pattern holes 132A are arranged at the first positionPO1, the second position PO2, and the third position PO3, respectively,line segments connecting the centers of the pattern holes 132A at therespective positions and line segments connecting the centers of thepixels Px may be parallel to each other, or may not form a right angle.That is, the line segments connecting the centers of the pixels Px maybe parallel to the first direction or the second direction, and anarbitrary straight line in which the center of the pattern hole 132A isshifted may be arranged diagonally with respect to the first directionor the second direction. In this case, the center of a first lowerauxiliary layer 28B-1A formed when the pattern hole 132A is arranged atthe first position PO1, the center of a second lower auxiliary layer28B-1B formed when the pattern hole 132A is arranged at the secondposition PO2, and the center of a third lower auxiliary layer 28B-1Cformed when the pattern hole 132A is arranged at the third position PO3may be different from each other so as to correspond to the positions ofthe centers of the pattern holes 132A.

Therefore, the mask assembly 130 or the process substrate MS may beprecisely shifted so that the auxiliary layer is accurately arranged oneach pixel when the auxiliary layer is formed. Also, the thickness ofthe intermediate layer of each pixel may be precisely controlled byaccurately overlapping at least two auxiliary layers in the pixel.

FIGS. 11A to 11C are cross-sectional views illustrating a procedure ofdepositing a deposition material on a process substrate according to thedeposition method illustrated in FIG. 8 or 10.

Referring to FIG. 11A, a first lower auxiliary layer 28B-1A may beformed on a display substrate D. The display substrate D may include asubstrate 21, each layer between the substrate 21 and a pixel defininglayer 29, the pixel defining layer 29, and a pixel electrode 28A.

In this case, after the display substrate D is arranged in the apparatus100 for manufacturing the light-emitting device, illustrated in FIG. 4,a deposition material may be deposited on the display substrate D. Atthis time, one or more display substrates D may be provided on a processsubstrate MS. That is, the display substrate D may refer to the processsubstrate MS itself or a portion of the process substrate MS. Inparticular, when the display substrate D is a portion of the processsubstrate MS, the display substrate D may include a deposition area ofthe process substrate MS.

After the mask assembly (not illustrated) is arranged to face thedisplay substrate D, a deposition material may be supplied to thedisplay substrate D through a deposition source (not illustrated).

A deposition material may be deposited on the display substrate Dthrough a pattern hole 132A of a mask sheet 132. In this case, thedeposition material may be deposited on the display substrate D arrangedin one first area A1, one second area A2, and two third areas A3, whichare included in one pixel group. When the deposition material isdeposited as described above, the deposition material may be depositedonly on some pixels included in one pixel group.

Referring to FIG. 11B, as illustrated in FIG. 11A, a second lowerauxiliary layer 28B-1B may be formed on the first lower auxiliary layer28B-1A. In this case, the second lower auxiliary layer 28B-1B may not bearranged on the entire surface of the first lower auxiliary layer28B-1A. That is, as illustrated in FIGS. 8 and 10, the second lowerauxiliary layer 28B-1B may be arranged to partially overlap the firstlower auxiliary layer 28B-1A in a plan view.

In order to form the second lower auxiliary layer 28B-1B as describedabove, the mask frame may be shifted in the first direction by a certaininterval. In this case, the degree of shifting of the mask frame may bean N multiple of the width of at least one pixel in the firstdirection.(N is a natural number). However, for convenience ofdescription, the case of shifting the mask frame by the width of onepixel in the first direction will be described in detail.

When the deposition material is deposited on the display substrate Dafter the mask assembly is shifted as described above, the depositionmaterial may be deposited on the display substrate D of two second areasand two third areas A3, except for the left first area A1 and the rightfirst area A1 of FIG. 11B. In this case, in the pixels arranged in theright second area A2 and the two third areas A3, the second lowerauxiliary layer 28B-1B may be arranged on the first lower auxiliarylayer 28B-1A.

Referring to FIG. 11C, after the second lower auxiliary layer 28B-1B isformed as described above, a third lower auxiliary layer 28B-1C may beformed on the second lower auxiliary layer 28B-1B. In this case, themask assembly may be shifted again in the first direction from theposition of FIG. 11B.

In this case, the pattern holes 132A may be arranged to correspond totwo third areas A3, the right second area A2, and the right first areaA1.

When the mask assembly is arranged as described above, a depositionmaterial may be supplied from a deposition source. In this case, thedeposition material is blocked by the mask sheet 132 in the first areaA1 and the second area A2 arranged on the left side, and the depositionmaterial that has passed through the pattern hole 132A may reach the twothird areas A3, the right second area A2, and the right first area A1and may be deposited on the display substrate D.

When the third lower auxiliary layer 28B-1C is formed as describedabove, the first lower auxiliary layer 28B-1A, the second lowerauxiliary layer 28B-1B, and the third lower auxiliary layer 28B-1C maybe sequentially formed on the pixel electrode 28A in the two third areasA3. Also, the second lower auxiliary layer 28B-1B and the third lowerauxiliary layer 28B-1C may be sequentially arranged on the pixelelectrode 28A in the right second area A2, and the third lower auxiliarylayer 28B-1C may be arranged on the pixel electrode 28A in the rightthird area A3.

The above process may not be limited to the above. For example, thedeposition material may be deposited on the display substrate D byshifting the mask assembly by 2N times the width of the pixel, insteadof shifting the mask assembly as described above. In another embodiment,the number of pixels corresponding to the pattern holes 132A may be lessthan or greater than the number of pixels illustrated in FIGS. 11A and11B. At this time, the number of pixels corresponding to the patternholes 132A may be two or more. In this case, the shifting distance ofthe mask assembly may be variously adjusted. For example, the shiftingdistance of the mask assembly may be adjusted to N times or 2N times thewidth of the pixel.

When the deposition material is deposited on the display substrate Dwhile shifting the mask assembly as described above, the same depositionmaterial may be deposited on each pixel of the display substrate D withdifferent thicknesses. In particular, as described above, when thedeposition material is the auxiliary layer, the thicknesses of theintermediate layers 28B of the respective pixels are different from eachother. Therefore, pieces of light having different wavelengths may beemitted within the same light-emitting portion (not illustrated).

FIG. 12 is a cross-sectional view of a portion of a light-emittingportion 20 of a light-emitting device, according to another embodiment.

Referring to FIG. 12, the light-emitting portion 20 may include asubstrate 21, a buffer layer 22, an active layer 23, a gate insulatinglayer 24, an interlayer insulating layer 26, a source electrode 27A, adrain electrode. 27B, a passivation layer 27, an OLED 28, a pixeldefining layer 29, and a thin-film encapsulation layer E. Because thebuffer layer 22, the active layer 23, the gate insulating layer 24, theinterlayer insulating layer 26, the source electrode 27A, the drainelectrode. 27B, the passivation layer 27, the pixel defining layer 29,and the thin-film encapsulation layer E are identical or similar tothose described above with reference to FIG. 3, detailed descriptionsthereof will be omitted.

The OLED 28 may include a pixel electrode 28A, an intermediate layer28B, and an opposite electrode 28C. At this time, because the pixelelectrode 28A and the opposite electrode 28C are identical or similar tothose described above with reference to FIG. 3, detailed descriptionsthereof will be omitted.

The intermediate layer 28B may include an organic emission layer 28B-2and an auxiliary layer. In this case, the auxiliary layer may include alower auxiliary layer 28B-1 and/or an upper auxiliary layer 28B-3.However, for convenience of description, a case in which the auxiliarylayer includes the lower auxiliary layer 28B-1 and the upper auxiliarylayer 28B-3 will be described in detail.

The lower auxiliary layer 28B-1 may include a first lower auxiliarylayer 28B-1A, a second lower auxiliary layer 28B-1B, and a third lowerauxiliary layer 28B-1C. In this case, the first lower auxiliary layer28B-1A, the second lower auxiliary layer 28B-1B, and the third lowerauxiliary layer 28B-1C may be identical or similar to those describedabove with reference to FIG. 3.

The organic emission layer 28B-2 may be arranged to correspond to apixel arranged in each area. That is, a plurality of organic emissionlayers 28B-2 may be provided to be apart from each other. In this case,the organic emission layers 28B-2 may be arranged to correspond topixels Px, respectively. In this case, the organic emission layers 28B-2may be spaced apart from each other on one surface of the displaysubstrate D and may be arranged in a certain pattern.

The upper auxiliary layer 28B-3 may be arranged on the organic emissionlayer 28B-2. In this case, the upper auxiliary layers 28B-3 may beintegrally formed with each other and may be arranged on all pixels Px.The upper auxiliary layer 28B-3 may include an electron injection layerand/or an electron transport layer.

In this case, the thickness of the intermediate layer 28B of each pixelPx may be adjusted by adjusting the thickness of the lower auxiliarylayer 28B-1 arranged on each pixel Px. Because the method of adjustingthe thickness of the lower auxiliary layer 28B-1 is identical or similarto that described above with reference to FIGS. 3 to 11C, a detaileddescription thereof will be omitted.

Therefore, the light-emitting portion 20 may emit pieces of light havingdifferent wavelengths to the outside while emitting pieces of lighthaving the same color.

The light-emitting portion 20 may operate in various ways. For example,the light-emitting portion 20 may cause a pixel arranged in at least oneof a first area A1, a second area A2, and a third area A3, arranged inone pixel group, to emit light.

Specifically, the light-emitting portion 20 may cause a pixel Pxarranged only in the first area A1, the second area A2, or the thirdarea A3 to emit light, thereby emitting light having one wavelength tothe outside.

In another embodiment, the light-emitting portion 20 may cause pixels Pxarranged in at least two of the first area A1, the second area A2, andthe third area A3 to emit light, thereby emitting pieces of light havingat least two wavelengths.

In another embodiment, the light-emitting portion 20 may cause pixels Pxarranged in the first area A1, the second area A2, and the third area A3to emit light according to time, thereby emitting pieces of light havingdifferent wavelengths at different times.

Therefore, because the light-emitting portion 20 may freely emit piecesof light having various wavelengths, pieces of light having variouseffects may be provided to a user.

The case in which the light-emitting portion 20 includes the thin-filmencapsulation layer E has been described above, but embodiments of thedisclosure are not limited thereto. That is, the light-emitting portion20 may include a separate encapsulation substrate facing the substrate21, and a sealing portion arranged between the substrate 21 and theseparate encapsulation substrate to attach the substrate 21 to theencapsulation substrate to thereby block the OLED 28 from the outside.

FIG. 13 is a cross-sectional view of a portion of a light-emittingportion 20 of a light-emitting device, according to another embodiment.

Referring to FIG. 13, the light-emitting portion 20 may include asubstrate 21, a buffer layer 22, an active layer 23, a gate insulatinglayer 24, an interlayer insulating layer 26, a source electrode 27A, adrain electrode. 27B, a passivation layer 27, an OLED 28, a pixeldefining layer 29, and a thin-film encapsulation layer E. Because thebuffer layer 22, the active layer 23, the gate insulating layer 24, theinterlayer insulating layer 26, the source electrode 27A, the drainelectrode. 27B, the passivation layer 27, the pixel defining layer 29,and the thin-film encapsulation layer E are identical or similar tothose described above with reference to FIG. 3, detailed descriptionsthereof will be omitted.

The OLED 28 may include a pixel electrode 28A, an intermediate layer28B, and an opposite electrode 28C. At this time, because the pixelelectrode 28A and the opposite electrode 28C are identical or similar tothose described above with reference to FIG. 3, detailed descriptionsthereof will be omitted.

The intermediate layer 28B may include an organic emission layer 28B-2and an auxiliary layer. In this case, the auxiliary layer may include alower auxiliary layer 28B-1 and/or an upper auxiliary layer 28B-3.However, for convenience of description, a case in which the auxiliarylayer includes the lower auxiliary layer 28B-1 and the upper auxiliarylayer 28B-3 will be described in detail.

The lower auxiliary layer 28B-1 may be arranged on all pixels Px. Inthis case, the lower auxiliary layer 28B-1 may include a hole injectionlayer and/or a hole transport layer. When the lower auxiliary layer28B-1 includes both the hole injection layer and the hole transportlayer, the hole injection layer and the hole transport layer may besequentially stacked on the pixel electrode 28A and the pixel defininglayer 29. In this case, the hole injection layer and the hole transportlayer may be shared by all the pixels Px. Hereinafter, for convenienceof description, a case in which the lower auxiliary layer 28B-1 is thehole transport layer will be described in detail.

The organic emission layer 28B-2 may be arranged on the lower auxiliarylayer 28B-1. In this case, as illustrated in FIG. 3, the organicemission layers 28B-2 may be integrally arranged on all the pixels Px.In another embodiment, as illustrated in FIG. 12, the organic emissionlayers 28B-2 may be apart from each other to correspond to each pixelPx. However, for convenience of description, a case in which the organicemission layers 28B-2 are integrally formed with each other so as to beshared by all the pixels Px will be described in detail.

The upper auxiliary layer 28B-3 may be arranged on the organic emissionlayer 28B-2. The upper auxiliary layer 28B-3 may include a first upperauxiliary layer 28B-3A, a second upper auxiliary layer 28B-3B, and athird upper auxiliary layer 28B-3C. In this case, each of the firstupper auxiliary layer 28B-3A, the second upper auxiliary layer 28B-3B,and the third upper auxiliary layer 28B-3C may include an electroninjection layer and/or an electron transport layer. In particular, thefirst upper auxiliary layer 28B-3A, the second upper auxiliary layer28B-3B, and the third upper auxiliary layer 28B-3C may include the samematerial or different materials.

The first upper auxiliary layer 28B-3A, the second upper auxiliary layer28B-3B, and the third upper auxiliary layer 28B-3C may be differentlystacked on the pixels Px arranged in each area. For example, in the caseof the pixel Px arranged in the first area A1 on the left side of FIG.13, only the first upper auxiliary layer 28B-3A may be arranged on theorganic emission layer 28B-2. In the case of the pixel Px arranged inthe second area A2 on the left side of FIG. 13, the first upperauxiliary layer 28B-3A and the second upper auxiliary layer 28B-3B maybe sequentially stacked on the organic emission layer 28B-2. In each ofthe pixels Px arranged in the two third areas A3 in the center of FIG.13, the first upper auxiliary layer 28B-3A, the second upper auxiliarylayer 28B-3B, and the third upper auxiliary layer 28B-3C may besequentially stacked on the organic emission layer 28B-2. In the case ofthe pixel Px arranged in the second area A2 on the left side of FIG. 13,the third upper auxiliary layer 28B-3C may be arranged on the secondupper auxiliary layer 28B-3B. In the case of the pixel Px arranged inthe first area A1 on the right side of FIG. 13, only the third upperauxiliary layer 28B-3C may be arranged on the organic emission layer28B-2.

In this case, the thickness of the intermediate layer 28B may bedetermined according to the number of upper auxiliary layers 28B-3arranged on the organic emission layer 28B-2. That is, when the numberof upper auxiliary layers 28B-3 arranged on the organic emission layer28B-2 of each pixel Px is greater than the number of upper auxiliarylayers 28B-3 arranged on the organic emission layer 28B-2 of anotherpixel Px, the thickness of the intermediate layer 28B of the pixel Pxhaving a large number of upper auxiliary layers 28B-3 may be greaterthan the thickness of the intermediate layer 28B of the other pixel Px.

The arrangement and number of the upper auxiliary layers 28B-3 may besimilar to the arrangement and number of the lower auxiliary layers28B-1 described above with reference to FIGS. 3 to 12. That is, thefirst upper auxiliary layer 28B-3A and the second upper auxiliary layer28B-3B may not completely overlap each other in a plan view, and thesecond upper auxiliary layer 28B-3B and the third upper auxiliary layer28B-3C may not completely overlap each other in a plane.

Because at least two pixels Px in which the thicknesses of theintermediate layers 28B are different are present, the light-emittingportion 20 may emit pieces of light having different wavelengths to theoutside while emitting pieces of light having the same color.

The light-emitting portion 20 may operate in various ways. For example,the light-emitting portion 20 may cause a pixel arranged in at least oneof the first area A1, the second area A2, and the third area A3,arranged in one pixel group, to emit light.

Specifically, the light-emitting portion 20 causes a pixel Px arrangedonly in the first area A1, the second area A2, or the third area A3 toemit light, thereby emitting light having one wavelength to the outside.

In another embodiment, the light-emitting portion 20 may cause pixels Pxarranged in at least two of the first area A1, the second area A2, andthe third area A3 to emit light, thereby emitting pieces of light havingat least two wavelengths.

In another embodiment, the light-emitting portion 20 may cause pixels Pxarranged in the first area A1, the second area A2, and the third area A3to emit light according to time, thereby emitting pieces of light havingdifferent wavelengths at different times.

Therefore, because the light-emitting portion 20 may freely emit piecesof light having various wavelengths, pieces of light having variouseffects may be provided to a user.

The case in which the light-emitting portion 20 includes the thin-filmencapsulation layer E has been described above, but embodiments of thedisclosure are not limited thereto. That is, the light-emitting portion20 may include a separate encapsulation substrate facing the substrate21, and a sealing portion arranged between the substrate 21 and theseparate encapsulation substrate to attach the substrate 21 to theencapsulation substrate to thereby block the OLED 28 from the outside.

The light-emitting device according to one or more embodiments maysupply pieces of light having different wavelengths to the outside.Also, the light-emitting devices may supply light having a certainwavelength to the outside.

According to the method of manufacturing the light-emitting device,according to one or more embodiments, the light-emitting deviceincluding the pixels having the intermediate layers with differentthicknesses may be manufactured.

According to the method of manufacturing the light-emitting device,according to one or more embodiments, the pixels having the intermediatelayers with different thicknesses may be manufactured in the singlemanufacturing apparatus without replacing the mask assembly for eachpixel.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A light-emitting device comprising: a bodyportion; and a light-emitting portion arranged in the body portion andconfigured to emit light to outside, wherein: the light-emitting portioncomprises: a plurality of pixels configured to emit same color; and apixel defining layer defining an emission area of each of the pluralityof pixels, at least two of the plurality of pixels are configured toemit pieces of light having different wavelengths from each other; andan auxiliary layer of an intermediate layer in each of the plurality ofpixels is arranged on at least two pixels adjacent to each other amongthe plurality of pixels and the pixel defining layer between adjacentpixels.
 2. The light-emitting device of claim 1, wherein each of theplurality of pixels is further configured to emit at least one of whitelight, red light, green light, and blue light.
 3. The light-emittingdevice of claim 1, wherein each of the plurality of pixels comprises: apixel electrode; an opposite electrode arranged to face the pixelelectrode; and an emission layer between the pixel electrode and theopposite electrode, and the auxiliary layer is arranged between theemission layer and the pixel electrode or between the emission layer andthe opposite electrode.
 4. The light-emitting device of claim 3, whereinat least two of the plurality of pixels have different intervals betweenthe pixel electrode and the opposite electrode.
 5. The light-emittingdevice of claim 1, wherein thicknesses of the auxiliary layers of thetwo pixels adjacent to each other among the plurality of pixels aredifferent from each other.
 6. The light-emitting device of claim 1,wherein thicknesses of the auxiliary layers of the two or more pixelsadjacent to each other among the plurality of pixels are different fromeach other.
 7. The light-emitting device of claim 1, wherein: theauxiliary layer comprises: a first auxiliary layer arranged on some ofthe plurality of pixels; and a second auxiliary layer arranged on othersof the plurality of pixels; and at least a portion of the firstauxiliary layer overlaps at least a portion of the second auxiliarylayer.
 8. The light-emitting device of claim 7, wherein a first lineconnecting centers of the first auxiliary layer and the second auxiliarylayer arranged on a plane intersects with a second line connectingcenters of adjacent pixels among the plurality of pixels.
 9. Thelight-emitting device of claim 3, wherein at least some of the pluralityof pixels form one pixel group, and a total thickness of theintermediate layers arranged in the one pixel group is greatest in thepixel arranged at a center of the one pixel group.
 10. Thelight-emitting device of claim 9, wherein the total thickness of theintermediate layers arranged in the one pixel group decreases from thepixel arranged at the center of the one pixel group to a pixel arrangedat an outer side of the one pixel group.
 11. The light-emitting deviceof claim 3, wherein thicknesses of at least two intermediate layers inthe plurality of pixels are different from each other.
 12. A method ofmanufacturing a light-emitting device, the method comprising: arranginga process substrate and a mask assembly in a chamber; depositing adeposition material by supplying the deposition material from adeposition source to the process substrate through the mask assembly;shifting the process substrate or the mask assembly in a firstdirection; and depositing a deposition material by supplying thedeposition material from the deposition source to the process substratethrough the mask assembly.
 13. The method of claim 12, furthercomprising shifting the process substrate or the mask assembly in asecond direction.
 14. The method of claim 13, wherein the firstdirection and the second direction are perpendicular to each other. 15.The method of claim 12, wherein the mask assembly comprises a patternhole through which the deposition material passes, and the pattern holeis formed to guide the deposition material to at least two pixelsarranged in a deposition area of the process substrate.
 16. The methodof claim 12, wherein the deposition material is deposited on the processsubstrate to form an auxiliary layer.
 17. The method of claim 12,further comprising depositing the deposition material in a depositionconfirmation area of the process substrate.
 18. The method of claim 17,wherein the deposition confirmation area is between adjacent depositionareas of the process substrate.
 19. A method of manufacturing alight-emitting device, the method comprising: depositing a depositionmaterial on a first area of a process substrate; and depositing adeposition material on a second area of the process substrate, whereinat least a portion of the first area overlaps at least a portion of thesecond area.
 20. The method of claim 19, wherein at least two pixels arearranged in each of the first area and the second area, and a thicknessof the deposition material in the pixel arranged only in the first areaor the second area is different from a thickness of the depositionmaterial in the pixel arranged in an area in which the first areaoverlaps the second area.